JPH0325942B2 - - Google Patents
Info
- Publication number
- JPH0325942B2 JPH0325942B2 JP533389A JP533389A JPH0325942B2 JP H0325942 B2 JPH0325942 B2 JP H0325942B2 JP 533389 A JP533389 A JP 533389A JP 533389 A JP533389 A JP 533389A JP H0325942 B2 JPH0325942 B2 JP H0325942B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- circuit board
- bent
- module
- branched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 45
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP533389A JPH0271551A (ja) | 1989-01-12 | 1989-01-12 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP533389A JPH0271551A (ja) | 1989-01-12 | 1989-01-12 | 半導体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2507083A Division JPS59151445A (ja) | 1983-02-17 | 1983-02-17 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0271551A JPH0271551A (ja) | 1990-03-12 |
JPH0325942B2 true JPH0325942B2 (en]) | 1991-04-09 |
Family
ID=11608312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP533389A Granted JPH0271551A (ja) | 1989-01-12 | 1989-01-12 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0271551A (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8310098B2 (en) | 2011-05-16 | 2012-11-13 | Unigen Corporation | Switchable capacitor arrays for preventing power interruptions and extending backup power life |
US9601417B2 (en) * | 2011-07-20 | 2017-03-21 | Unigen Corporation | “L” shaped lead integrated circuit package |
JP7215344B2 (ja) * | 2019-06-11 | 2023-01-31 | 株式会社デンソー | 半導体装置 |
-
1989
- 1989-01-12 JP JP533389A patent/JPH0271551A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0271551A (ja) | 1990-03-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7563645B2 (en) | Electronic package having a folded package substrate | |
US5976914A (en) | Method of making plastic package for a surface mounted integrated circuit | |
KR100893653B1 (ko) | 접힌 유연성 기판을 포함하는 전자 패키지 및 전자패키지를 제조하는 방법 | |
US5969416A (en) | Ball grid array semiconductor package | |
US6483189B1 (en) | Semiconductor device | |
JPH0325942B2 (en]) | ||
US5728247A (en) | Method for mounting a circuit | |
JPH0239587A (ja) | 高密度実装プリント板 | |
JP2541532B2 (ja) | 半導体モジュ―ル | |
KR100373149B1 (ko) | 반도체 패키지 | |
JPS62235799A (ja) | 混成集積回路装置 | |
WO1996030943A1 (en) | Thin profile integrated circuit package | |
JPH0817960A (ja) | Qfp構造半導体装置 | |
JP2569214Y2 (ja) | フレキシブル基板の固定機構 | |
JPH0778938A (ja) | 複合半導体装置及びその製造方法 | |
JPH07122701A (ja) | 半導体装置およびその製造方法ならびにpga用リードフレーム | |
JPH0514516Y2 (en]) | ||
JPH0150109B2 (en]) | ||
JP2912813B2 (ja) | 電子部品 | |
JPS5989447A (ja) | 半導体装置 | |
KR20040077465A (ko) | 전자부품 탑재용 케이스 및 그 형성방법 | |
JP2606673B2 (ja) | 実装体 | |
KR100525091B1 (ko) | 반도체 패키지 | |
JP2568812B2 (ja) | 実装体 | |
JPH0119395Y2 (en]) |