JPH0325942B2 - - Google Patents

Info

Publication number
JPH0325942B2
JPH0325942B2 JP533389A JP533389A JPH0325942B2 JP H0325942 B2 JPH0325942 B2 JP H0325942B2 JP 533389 A JP533389 A JP 533389A JP 533389 A JP533389 A JP 533389A JP H0325942 B2 JPH0325942 B2 JP H0325942B2
Authority
JP
Japan
Prior art keywords
semiconductor device
circuit board
bent
module
branched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP533389A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0271551A (ja
Inventor
Masahiko Tsumori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP533389A priority Critical patent/JPH0271551A/ja
Publication of JPH0271551A publication Critical patent/JPH0271551A/ja
Publication of JPH0325942B2 publication Critical patent/JPH0325942B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP533389A 1989-01-12 1989-01-12 半導体装置 Granted JPH0271551A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP533389A JPH0271551A (ja) 1989-01-12 1989-01-12 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP533389A JPH0271551A (ja) 1989-01-12 1989-01-12 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2507083A Division JPS59151445A (ja) 1983-02-17 1983-02-17 半導体装置

Publications (2)

Publication Number Publication Date
JPH0271551A JPH0271551A (ja) 1990-03-12
JPH0325942B2 true JPH0325942B2 (en]) 1991-04-09

Family

ID=11608312

Family Applications (1)

Application Number Title Priority Date Filing Date
JP533389A Granted JPH0271551A (ja) 1989-01-12 1989-01-12 半導体装置

Country Status (1)

Country Link
JP (1) JPH0271551A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8310098B2 (en) 2011-05-16 2012-11-13 Unigen Corporation Switchable capacitor arrays for preventing power interruptions and extending backup power life
US9601417B2 (en) * 2011-07-20 2017-03-21 Unigen Corporation “L” shaped lead integrated circuit package
JP7215344B2 (ja) * 2019-06-11 2023-01-31 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
JPH0271551A (ja) 1990-03-12

Similar Documents

Publication Publication Date Title
US7563645B2 (en) Electronic package having a folded package substrate
US5976914A (en) Method of making plastic package for a surface mounted integrated circuit
KR100893653B1 (ko) 접힌 유연성 기판을 포함하는 전자 패키지 및 전자패키지를 제조하는 방법
US5969416A (en) Ball grid array semiconductor package
US6483189B1 (en) Semiconductor device
JPH0325942B2 (en])
US5728247A (en) Method for mounting a circuit
JPH0239587A (ja) 高密度実装プリント板
JP2541532B2 (ja) 半導体モジュ―ル
KR100373149B1 (ko) 반도체 패키지
JPS62235799A (ja) 混成集積回路装置
WO1996030943A1 (en) Thin profile integrated circuit package
JPH0817960A (ja) Qfp構造半導体装置
JP2569214Y2 (ja) フレキシブル基板の固定機構
JPH0778938A (ja) 複合半導体装置及びその製造方法
JPH07122701A (ja) 半導体装置およびその製造方法ならびにpga用リードフレーム
JPH0514516Y2 (en])
JPH0150109B2 (en])
JP2912813B2 (ja) 電子部品
JPS5989447A (ja) 半導体装置
KR20040077465A (ko) 전자부품 탑재용 케이스 및 그 형성방법
JP2606673B2 (ja) 実装体
KR100525091B1 (ko) 반도체 패키지
JP2568812B2 (ja) 実装体
JPH0119395Y2 (en])